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PRODUCT DESCRIPTION | ||
NO. | ITEM | DESCRIPTION |
1 | Material | Aluminum alloy 6060,6061,6063,T3,T5 |
2 | Dimension (Diameter*H) | Up to Φ200*120 mm |
3 | Fin Spacing | Minimum 2.5 mm |
4 | Fin thickness | Minimum 1.5 mm |
5 | Cooling Capacity | Up to 600 W |
6 | Flatness for mounting surface | 0.15 mm |
7 | Manufacturing Method | Aluminum extrusion PLUS further cnc machining if needed |
8 | Cooling Method | Natural or forced air cooling |
9 | Surface Finish | Mill finish,anodization,painting or powder coating |
10 | Warranty time | 1 year |
11 | Place of Region | Jiangsu province of China |
12 | Reference Standard | GB/T 3190-2008,GB/T 14846-2008,ISO 2768 |
A laptop sun flower heat sink with fan is a specialized type of heat sink used in laptops to dissipate the heat generated by the laptop's processor and other electronic components. The heat sink is designed with a fan and a sunflower-shaped heat sink to provide efficient cooling for the laptop.
The sunflower-shaped heat sink is made of aluminum or copper and is designed with a series of fins that increase the surface area for heat dissipation. The fan is mounted directly onto the heat sink and is designed to circulate air over the heat sink, speeding up the heat dissipation process.
The laptop sun flower heat sink with fan is typically installed directly onto the laptop's processor, using thermal paste or thermal adhesive. The heat generated by the processor is then transferred to the heat sink, which dissipates the heat into the surrounding environment through convection and radiation.
Metalli’s heat sink technologies include
◆ CNC machined aluminum fins heat sink
◆ Skived aluminum heat sink
◆ Vacuum brazed bonded aluminum fins heat sink
◆ Extruded aluminum heat sink
◆ Die casting aluminum heat sink
◆ Epoxy glued bonded aluminum fin heat sink
▲ Copper heat sink
Metalli’s manufacture a wide range of heat sink include
● Cpu gpu ram heat sink
● Led aluminum heat sink
● Heat sink aluminum enclosure
● Copper heat pipe heat sink
● Liquid water cooling heat sink
● Inverter Aluminum Heatsink
● Other custom heat sinks
▲ Skived aluminum heat sink with copper heat pipe
Brief of heat sink
A heat sink (also commonly spelled heatsink) is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of the device's temperature. In computers, heat sinks are used to cool CPUs, GPUs, and some chipsets and RAM modules. Heat sinks are used with high-power semiconductor devices such as power transistors and optoelectronics such as lasers and light-emitting diodes (LEDs), where the heat dissipation ability of the component itself is insufficient to moderate its temperature.
A heat sink is designed to maximize its surface area in contact with the cooling medium surrounding it, such as the air. Air velocity, choice of material, protrusion design and surface treatment are factors that affect the performance of a heat sink. Heat sink attachment methods and thermal interface materials also affect the die temperature of the integrated circuit. Thermal adhesive or thermal paste improve the heat sink's performance by filling air gaps between the heat sink and the heat spreader on the device. A heat sink is usually made out of aluminum or copper.
PRODUCT DESCRIPTION | ||
NO. | ITEM | DESCRIPTION |
1 | Material | Aluminum alloy 6060,6061,6063,T3,T5 |
2 | Dimension (Diameter*H) | Up to Φ200*120 mm |
3 | Fin Spacing | Minimum 2.5 mm |
4 | Fin thickness | Minimum 1.5 mm |
5 | Cooling Capacity | Up to 600 W |
6 | Flatness for mounting surface | 0.15 mm |
7 | Manufacturing Method | Aluminum extrusion PLUS further cnc machining if needed |
8 | Cooling Method | Natural or forced air cooling |
9 | Surface Finish | Mill finish,anodization,painting or powder coating |
10 | Warranty time | 1 year |
11 | Place of Region | Jiangsu province of China |
12 | Reference Standard | GB/T 3190-2008,GB/T 14846-2008,ISO 2768 |
A laptop sun flower heat sink with fan is a specialized type of heat sink used in laptops to dissipate the heat generated by the laptop's processor and other electronic components. The heat sink is designed with a fan and a sunflower-shaped heat sink to provide efficient cooling for the laptop.
The sunflower-shaped heat sink is made of aluminum or copper and is designed with a series of fins that increase the surface area for heat dissipation. The fan is mounted directly onto the heat sink and is designed to circulate air over the heat sink, speeding up the heat dissipation process.
The laptop sun flower heat sink with fan is typically installed directly onto the laptop's processor, using thermal paste or thermal adhesive. The heat generated by the processor is then transferred to the heat sink, which dissipates the heat into the surrounding environment through convection and radiation.
Metalli’s heat sink technologies include
◆ CNC machined aluminum fins heat sink
◆ Skived aluminum heat sink
◆ Vacuum brazed bonded aluminum fins heat sink
◆ Extruded aluminum heat sink
◆ Die casting aluminum heat sink
◆ Epoxy glued bonded aluminum fin heat sink
▲ Copper heat sink
Metalli’s manufacture a wide range of heat sink include
● Cpu gpu ram heat sink
● Led aluminum heat sink
● Heat sink aluminum enclosure
● Copper heat pipe heat sink
● Liquid water cooling heat sink
● Inverter Aluminum Heatsink
● Other custom heat sinks
▲ Skived aluminum heat sink with copper heat pipe
Brief of heat sink
A heat sink (also commonly spelled heatsink) is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of the device's temperature. In computers, heat sinks are used to cool CPUs, GPUs, and some chipsets and RAM modules. Heat sinks are used with high-power semiconductor devices such as power transistors and optoelectronics such as lasers and light-emitting diodes (LEDs), where the heat dissipation ability of the component itself is insufficient to moderate its temperature.
A heat sink is designed to maximize its surface area in contact with the cooling medium surrounding it, such as the air. Air velocity, choice of material, protrusion design and surface treatment are factors that affect the performance of a heat sink. Heat sink attachment methods and thermal interface materials also affect the die temperature of the integrated circuit. Thermal adhesive or thermal paste improve the heat sink's performance by filling air gaps between the heat sink and the heat spreader on the device. A heat sink is usually made out of aluminum or copper.
