Copper Raspberry Pi Pin Fin Skived Heat Sink

A copper Raspberry Pi pin fin heat sink is a specialized type of heat sink designed for use with the Raspberry Pi, a small single-board computer. The heat sink is designed to dissipate the heat generated by the Raspberry Pi's processor and other electronic components, which can cause the computer to overheat and malfunction.

The heat sink is made of copper, which is an excellent thermal conductor and allows for efficient heat dissipation. The pin fin design of the heat sink provides a large surface area for cooling, allowing for optimal thermal performance.

The heat sink is designed to be mounted directly onto the Raspberry Pi's processor, using either thermal adhesive or screws. The pins on the heat sink make contact with the processor, providing a direct heat transfer path from the processor to the heat sink.

Metalli's heat sink technologies include

◆ CNC machined aluminum fins heat sink

◆ Skived aluminum heat sink

◆ Vacuum brazed bonded aluminum fins heat sink

◆ Extruded aluminum heat sink

◆ Die casting aluminum heat sink

◆ Epoxy glued bonded aluminum fin heat sink

▲ Copper heat sink                            

Metalli's manufacture a wide range of heat sink include

● Cpu gpu ram heat sink

● Led aluminum heat sink

● Heat sink aluminum enclosure

● Copper heat pipe heat sink

● Liquid water cooling heat sink

● Inverter Aluminum Heatsink

● Other custom heat sinks

▲ Skived aluminum heat sink with copper heat pipe

Brief of heat sink

A heat sink (also commonly spelled heatsink) is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of the device's temperature. In computers, heat sinks are used to cool CPUs, GPUs, and some chipsets and RAM modules. Heat sinks are used with high-power semiconductor devices such as power transistors and optoelectronics such as lasers and light-emitting diodes (LEDs), where the heat dissipation ability of the component itself is insufficient to moderate its temperature.

A heat sink is designed to maximize its surface area in contact with the cooling medium surrounding it, such as the air. Air velocity, choice of material, protrusion design and surface treatment are factors that affect the performance of a heat sink. Heat sink attachment methods and thermal interface materials also affect the die temperature of the integrated circuit. Thermal adhesive or thermal paste improve the heat sink's performance by filling air gaps between the heat sink and the heat spreader on the device. A heat sink is usually made out of aluminum or copper.