Aluminum Folded Stacked Skived Fin Heat Sink

Product name : Aluminum folded stacked skived fin heat sink

Aluminum folded stacked skived fin heat sinks are a thermal management solution commonly used in electronic devices and applications. These heat sinks utilize a series of aluminum fins, which are folded, stacked, and skived to create an efficient pathway for heat transfer. The folded design increases the surface area of the fins, allowing for more excellent heat dissipation, while the stacking allows for more fins to be placed in a smaller space. The skiving process creates a wavy shape on the fins, which enhances the heat transfer capabilities by reducing the boundary layer of air. This innovative design, coupled with aluminum's lightweight and durable nature, make these heat sinks ideal for applications where high-performance cooling is required in a compact space. They are commonly found in applications such as LED lighting, power supplies, computer central processing units (CPUs), and other electronics that generate significant amounts of heat.

M-stirling's heat sink technologies include

◆ CNC machined aluminum fins heat sink

◆ Skived aluminum heat sink

◆ Vacuum brazed bonded aluminum fins heat sink

◆ Extruded aluminum heat sink

◆ Die casting aluminum heat sink

◆ Epoxy glued bonded aluminum fin heat sink

▲ Copper heat sink

M-stirling's manufacture a wide range of heat sink include

●    Cpu gpu ram heat sink

●    Led aluminum heat sink

●    Heat sink aluminum enclosure

●    Copper heat pipe heat sink

●    Liquid water cooling heat sink

●    Inverter Aluminum Heatsink

●    Other custom heat sinks

▲ Skived aluminum heat sink with copper heat pipe

Brief of heat sink

A heat sink (also commonly spelled heatsink) is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of the device's temperature. In computers, heat sinks are used to cool CPUs, GPUs, and some chipsets and RAM modules. Heat sinks are used with high-power semiconductor devices such as power transistors and optoelectronics such as lasers and light-emitting diodes (LEDs), where the heat dissipation ability of the component itself is insufficient to moderate its temperature.

A heat sink is designed to maximize its surface area in contact with the cooling medium surrounding it, such as the air. Air velocity, choice of material, protrusion design and surface treatment are factors that affect the performance of a heat sink. Heat sink attachment methods and thermal interface materials also affect the die temperature of the integrated circuit. Thermal adhesive or thermal paste improve the heat sink's performance by filling air gaps between the heat sink and the heat spreader on the device. A heat sink is usually made out of aluminum or copper.